AI

:

Auto-Insertion

AQL

:

acceptable quality level

ATE

:

automatic test equipment

ATM

:

atmosphere

BGA

:

ball grid array

CCD

:

charge coupled device

CLCC

:

Ceramic leadless chip carrier

COB

:

chip-on-board

cps

:

centipoises (黏度單位)

CTE

:

coefficient of thermal expansion

DIP

:

dual in-line package

IC

:

integrate circuit

IR

:

infra-red

Kpa

:

kilopascals(壓力單位)

LCC

:

leadless chip carrier

PCB

:

printed circuit board

PLCC

:

plastic leadless chip carrier

polyurethane

:

聚亞胺酯

psi

:

pounds / inch²

PWB

:

printed wiring board

QFP

:

quad flat package

SIP

:

single in-line package

SIR

:

surface insulation resistance

SMC

:

Surface Mount Component

SMD

:

Surface Mount Device

SMEMA

:

Surface Mount Equipment Manufacturers Association

SMT

:

surface mount technology

SOJ

:

small out-line J-leaded package

SOP

:

small out-line package

TAB

:

tape automatic bonding

TCE

:

thermal coefficient of expansion

Tg

:

glass transition temperature

THD

:

Through hole device