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Statistical Process Control

2010/02/16 11:36:39瀏覽496｜回應2｜推薦3

Statistical Process Control (SPC) is based on the principle that the process parameters and the hardware setting are to be invariant during long period of wafer processing time.
The SPC tracks certain metrics of process, typically some wafer stage parameters and declaresthis process to be out of control when the established control limit is exceeded with s specified statistical significance.
Such SPC suffers from a mypic view of process domain - looking at one or only a few parameters, and the recognition of a problem situation is always delayed.
It became clear these constraints must be removed in order to meet the requirements of ever decreasing device size and increasing wafer size.
Process anomalies must be determined by examining a much wider domain of parameters, detected in shorter time frame, and focused on decreasing the variance of the wafer state parameters.

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