技術文件麻煩高手指導中翻英 - Joseph Chen 中英文翻譯工作室

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技術文件麻煩高手指導中翻英

2009/05/23 06:49:25瀏覽581｜回應0｜推薦0

F.元件的可焊接性
1.紀錄每個元件（BGA用的合金焊球）的含鉛量和終止修整期間(非IC)。
2.使用 J-STD-002B,
第3類老化(≈93°C, 100RH, 8 hrs)標準，執行可焊接性測試。進行表面組裝元件的測試。Test
S必需在板型組合，使用製造用焊膠，裝置最佳的鍋爐回流製程條件下，進行測試。使用穿孔元件用的沾視測試 A
(各類元件最少10個)。假如係使用同等級的規格時，必需提供相關的同等級測試方法、評估內容和標準。可焊接性不適用於BGA封裝產品。
3.標準：所有的鉛質，必需可以進行連續焊接，最少有95%的各個鉛件，未出現缺陷。
4.在附表中，紀錄樣品尺寸和測試結果。

ComponentSolderability

1.Record lead contents or finsihing termination(non IC)periods on eachcomponent (solder alloy balls for BGAs).

2.Perform
solderability testing in compliance with J-STD-002B, category 3 aging
(≈93C, 100RH, 8 hrs), Test S is used for surface mount components. Test
S is to be performed at the board assembly location with production
paste, in compliance with optimized reflow oven profiles. Use the Dip
and Look Test A for through-hole components (atleast 10 pieces for each
type of component). If any equivaent standard is used, details must be
provided with the equivalency inany test method, evaluation, and
criteria applied. These Solderability tests do not apply to BGA
packages.

3.Criteria:
All leads shall exhibit a continuous solder coating and have no defect
shown at a minimum of 95% of the critical area for any individual lead.

4.Record sample sizes and test results in the attached table.

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